EMI/RFI Shielding & Thermal Management
Ground-Fast™
Device Technologies' Ground-Fast grounding system quickly attaches a lid or cover to a panel protecting printed circuit boards and electronic components. The fastener combines mounting clips, which quickly snap into holes to create an electrical ground contact from the lid to the panel.
Shield-Fast™ EMI-RFI Shielding
DTi offers Conductive Gaskets and Tapes for a wide variety of EMI shielding applications. The gaskets consist of a conductive fabric on a highly compressed polyurethane foam core with a conductive adhesive tape. Conductive fabric and metal tapes are composed of a conductive substrate and adhesive offering a thin, lightweight, and flexible design.
Shield-Fast™ Thermal Interface Materials
Effective heat transfer in electronic devices is critical for optimum performance. DTi's thermal interface materials offer the highest levels of thermal conductivity, conformability and mange heat in electronic assemblies and printed ciruit boars, especially where surface topography and air gaps are a concern.
Shield-Fast™ RF Absorber Materials
DTi offers the FA Series RF Absorber Materials for the suppression of electromagnetic waves in electronic devices. Our material covers a wide frequency range (10MHz ~ 18GHz) to provide excellent suppression of high frequency radiated noise, conduction noise, and electrical surge.
Protect-Fast™ - Shield Expander
DTi’s Protect-Fast™ Shield Expander provides excellent flexibility and cable organizing within a variety of applications including telecommunications, automotive, and data center design. It also provides excellent cable shielding effectiveness and grounding because of its woven fibers and conductive copper wire design.
