EMI/RFI Shielding & Thermal Management

Ground Fast™: Heel & Toe Grounding Clip

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Ground Fast™ Features

• Flush surface mounting

• Fast snap-in or solder attachment

• Fast removal of lid from panel

• High closure force

• High tensile strength

Device Technologies' Ground-Fast™ grounding system quickly attaches a lid or cover to a panel protecting printed circuit boards and electronic components. The fastener combines mounting clips, which quickly snap into holes to create an electrical ground contact from the lid to the panel.

Material:

  • 304 Stainless Steel

Electrical Resistivity:

  • 28.4μΩ-in. @ 68°F (72μΩ-cm @ 20°C)

Mounting Dimensions:

  • Clip Hole Diameter: 0.180 in. (4.57 mm)
  • Panel Thickness: 0.060 in. (1.52 mm)

Other DTi Services

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 Device Technologies offers a variety of custom services to suit a wide variety of needs.  Our custom services include:

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