EMI/RFI Shielding & Thermal Management
Device Technologies' Ground-Fast grounding system quickly attaches a lid or cover to a panel protecting printed circuit boards and electronic components. The fastener combines mounting clips, which quickly snap into holes to create an electrical ground contact from the lid to the panel.
Shield-Fast™ Fabric Over Foam
DTi offers Conductive Gaskets and Tapes for a wide variety of EMI shielding applications. The gaskets consist of a conductive fabric on a highly compressed polyurethane foam core with a conductive adhesive tape. Conductive fabric and metal tapes are composed of a conductive substrate and adhesive offering a thin, lightweight, and flexible design.
Shield-Fast™ Thermal Interface Materials
Effective heat transfer in electronic devices is critical for optimum performance. DTi's thermal interface materials offer the highest levels of thermal conductivity, conformability and mange heat in electronic assemblies and printed ciruit boars, especially where surface topography and air gaps are a concern.
Shield-Fast™ RF Absorber Materials
DTi offers the FA Series RF Absorber Materials for the suppression of electromagnetic waves in electronic devices. Our material covers a wide frequency range (10MHz ~ 18GHz) to provide excellent suppression of high frequency radiated noise, conduction noise, and electrical surge.
Protect-Fast™ - Shield Expander
DTi’s Protect-Fast™ Shield Expander provides excellent flexibility and cable organizing within a variety of applications including telecommunications, automotive, and data center design. It also provides excellent cable shielding effectiveness and grounding because of its woven fibers and conductive copper wire design.
DTi offers an extremely broad range of metal foil based conductive adhesive tapes. The SMT and DMT Series Metal Foil Tapes are produced using highly conductive adhesives either on their own or combined with a variety of metal foils.
Shield-Fast™ Conductive Fabric
DTi’s Conductive Fabric Tapes are composed of a conductive substrate and adhesive. They offer a thin, lightweight, and flexible shielding design. The ST and ST series’ pressure sensitive adhesives (PSA) are produced using highly conductive adhesives either on their own or combined with conductive textiles.
Shield-Fast™ Conductive Cushion Gasket
Conductive cushion gaskets offer an innovative approach to traditional sheilding and grounding by providing X, Y, and Z axis conductivity which enhances the shielding effectiveness. This is required to meet the increasing microprocessor speeds of today's computer, telecommunications and aerospace equipment.
Shield-Fast™ Stamped Finger Gaskets
S Series Stamped Finger Gaskets combine high levels of EMI effectiveness with finger contact and low closure force properties. Beryllium Copper (BeCu C17200 alloy) offers high performance EMI shielding qualities over a broad frequency range. S Series Gaskets can be plated with tin or gold.