Device Technologies designs, manufactures and delivers EMI shielding gaskets, grounding, EMI absorber and thermal management solutions for demanding, mission critical applications. Our engineering team collaborates closely with you to define the ultimate cost effective solution using innovative materials, processes and manufacturing disciplines to solve complex shielding and thermal problems utilizing high quality and low cost EMI shielding materials of all shapes and sizes to protect electromagnetic signals. We manufacture a wide range of EMI/RFI shielding products such as EMI Gaskets, RF Absorber, Conductive Silicone, Thermal management and conductive tapes in both metallic and fabric form factors.
We serve global industries where continuous connectivity, high performance and safety count. We partner closely with customers across the entire product development life-cycle to reduce risk and accelerate time-to-market; solving the challenges of today and anticipating those of tomorrow.
Device Technologies’ Ground-Fast grounding system quickly attaches a lid or cover to a panel protecting printed circuit boards and electronic components. The fastener combines mounting clips, which quickly snap into holes to create an electrical ground contact from the lid to the panel.
DTi offers Conductive Fabric Over Foam Gaskets for a wide variety of EMI shelding applications. It consists of a conductive fabric on a highly compressed polyurethane foam core with a conductive adhesive tape. Excellent flexibility with superior adhesive strength guarantee a precise fit on uneven surfaces.
DTi’s Conductive Fabric Over Foam also offers a gold fabric option, providing increased conductivity and minimum oxidation over the nickel or silver fabrics. No matter what the application is, we can work with you to design the optimal EMI Shielding Gasket.
Effective heat transfer in electronic devices is critical for optimum performance. DTi’s thermal interface materials offer the highest levels of thermal conductivity, conformability and manage heat in electronic assemblies and printed circuit boards, especially where surface topography and air gaps are a concern.
DTi offers the FA Series RF Absorber Materials for the suppression of electromagnetic waves in electronic devices. Our material covers a wide frequency range (10MHz ~ 18GHz) to provide excellent suppression of high frequency radiated noise, conduction noise, and electrical surge.
DTi’s Protect-Fast™ Shield Expander provides excellent flexibility and cable organizing within a variety of applications including telecommunications, automotive, and data center design. It also provides excellent cable shielding effectiveness and grounding because of its woven fibers and conductive copper wire design.
ST & DT Series
DTi’s Conductive Fabric Tapes are composed of a conductive substrate and adhesive. They offer a thin, lightweight, and flexible shielding design. The ST and ST series’ pressure sensitive adhesives (PSA) are produced using highly conductive adhesives either on their own or combined with conductive textiles.
Conductive cushion gaskets offer an innovative approach to traditional shielding and grounding by providing X, Y, and Z axis conductivity which enhances the shielding effectiveness. This is required to meet the increasing microprocessor speeds of today’s computer, telecommunications and aerospace equipment.