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Ground Fast™
Device Technologies Free Sample Kit

Ground-Fast:  Heel & Toe Grounding Clip

Ground Fast™: Heel & Toe Grounding Clip

Device Technologies’ Ground-Fast grounding system quickly attaches a lid or cover to a panel protecting printed circuit boards and electronic components. The fastener combines mounting clips, which quickly snap into holes to create an electrical ground contact from the lid to the panel.


  • 304 Stainless Steel

Electrical Resistivity:

  • 28.4μΩ-in. @ 68°F (72μΩ-cm @ 20°C)


Ground-Fast Features

  • Flush surface mounting
  • Fast snap-in or solder attachment
  • Fast removal of lid from panel
  • High closure force
  • High tensile strength
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